Thapar Institute of Engineering and Technology University (Thapar University) – Patiala Placements

  Patiala   UGC, AICTE, NAAC, NBA, MHRD   ESTD 1956
  Patiala   UGC, AICTE, NAAC, NBA, MHRD   ESTD 1956

Placements

There are various placement offers for its students. CILP (Center for Industrial Liasion & Placement) arranges campus interviews for placement of final year students of all branches by inviting various Public Sector and Private organization. A database of organizations is available with CILP which is continuously updated.

CILP assists in arranging project semester slots for various branches of engineering.ME/M.Tech Students from Computer Science, Electrical Instrumentation, Electronics Communication, Biotech & Mechanical Engineering Departments go for One Year Internship.

CILP also assists in arranging six week’s summer training for students of BE IIyr of Electronics and Communication Engineering, Electronics (Instrumentation & Control), Electrical and Computer Engineering disciplines.

CILP is closely involved in Industry/Institute Interaction Programmes such as Faculty Exchange Programme, Mobility of Industrial Personnel Programme and Joint Research Projects in collaboration with industries.

Academic Year : 2017-2018*

Companies Visiting TIET – 298

Single Offer- 729
Multiple Offers- 195
Total Placed- 924
Total Offers- 1124

*Till 30.06.2018
436 students placed for internship for 2017-18.PPO will be declared by end July 2018.

Academic Year : 2016-2017

Companies Visiting TIET – 272

Single Offer- 860
Multiple Offers- 169
Total Placed- 1029
Total Offers- 1213

Yearwise

Year Companies Visited Highest Package Average Package
2018 24 LPA 5.5 LPA